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TSMC / Phoenix / Arizona / US
4nm wafer fabrication in the first fab; 3nm and 2nm fabs to follow
Fab 21 is the manufacturing entity of TSMC Arizona, the company's advanced semiconductor manufacturing operation in Phoenix, on a parcel of about 4,775,885 square meters the subsidiary owns. Its first facility entered high volume production at the end of 2024; TSMC said that fab would begin production leveraging 4nm technology, that the second would add 2nm to the previously announced 3nm from 2028, and that the third would use 2nm or more advanced processes by the end of the decade. TSMC states that the site employs more than 3,000 people on 1,100 acres, and it has announced an intention to expand its United States investment by a further $100 billion, adding three fabrication plants, two advanced packaging facilities and a major R&D team center in what it called the largest single foreign direct investment in U.S. history.
TSMC Arizona’s first fab is on track to begin production leveraging 4nm technology in first half of 2025. The second fab will produce the world’s most advanced 2nm process technology with next-generation nanosheet transistors in addition to the previously announced 3nm technology, with production beginning in 2028. The third fab will produce chips using 2nm or more advanced processes, with production beginning by the end of the decade.
TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix · TSMC · read 2026-09-05
Building on the company’s ongoing $65 billion investment in its advanced semiconductor manufacturing operations in Phoenix, Arizona, TSMC’s total investment in the U.S. is expected to reach US$165 billion.
TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI · TSMC · read 2026-09-05
TSMC's Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona.
TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI · TSMC · read 2026-09-05
TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion.
TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI · TSMC · read 2026-09-05
The expansion includes plans for three new fabrication plants, two advanced packaging facilities and a major R&D team center, solidifying this project as the largest single foreign direct investment in U.S. history.
TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI · TSMC · read 2026-09-05
Published figures for 2023, from the source named under them.
United States as a whole ran at 384 g of CO2 per kWh in 2025, from Ember.
Those plants report to Arizona Public Service Company, Salt River Project and Western Area Power Administration - Desert Southwest Region and 1 more.
A radius, not a supply. No public source states which plant serves which site, and nothing here says one does.
Who TSMC buys from and sells to, each relationship carrying the source that states it.
Supplies 300mm CVD, PVD, etch, CMP and ion implant systems
The volume order from TSMC includes Applied Materials' advanced 300mm systems for chemical vapor deposition (CVD), physical vapor deposition (PVD), etch, CMP (chemical mechanical planarization), and ion implant applications as well as for process diagnostics and control.
Just a moment... · TSMC · read 2026-09-05
Supplies EUV lithography systems (TWINSCAN NXE:3100)
ASML Holding NV (ASML) today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system.
Just a moment... · TSMC · read 2026-09-05
Supplies H200 GPUs and CUDA-accelerated computation for fab operations
By harnessing CUDA-powered computation on NVIDIA H200 GPUs, TSMC has enhanced its capability to manage complex constraints, thereby streamlining production paths and maximizing fab productivity.
NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing | NVIDIA Newsroom · NVIDIA · read 2026-09-05
Supplies Process control and inspection equipment
For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited
klac-20260630 (Form 10-K, fiscal 2026) · KLA Corporation · read 2026-09-11
Supplies Semiconductor materials and contamination-control products
2025 2024 2023 Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16% 16% 11%
entg-20251231 (Form 10-K, 2025) · Entegris, Inc. · read 2026-09-11
Supplies Semiconductor production equipment
Major customer information (Millions of yen) Net sales Name of customer Samsung Electronics Co., Ltd. 368,079 Taiwan Semiconductor Manufacturing Company Ltd. 315,813 (Note) The amount includes sales to the customer and its subsidiaries.
Consolidated Financial Statements FY2026 · Tokyo Electron Limited · read 2026-09-11
Supplies Semiconductor test systems
The customer groups that accounted for 10% or more of the net sales were the NVIDIA Group and Taiwan Semiconductor Manufacturing Co., Ltd. for the fiscal year ended March 31, 2026.
Securities and Business Report, 84th fiscal year (ended March 31, 2026) · Advantest Corporation · read 2026-09-11
Supplies Wafer fabrication equipment
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K fiscal 2026) · Lam Research Corporation · read 2026-09-11
Supplies Wafer fabrication equipment and services
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K, fiscal 2026) · Lam Research Corporation · read 2026-09-11
Buys 12/16nm FinFET and 22/28nm process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC · read 2026-09-05
Buys 22/28nm and 12/16nm FinFET process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC, Sony Semiconductor Solutions, and DENSO · read 2026-09-05
Buys 28/22nm planar CMOS and 16/12nm FinFET process technology
When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology.
Just a moment... · TSMC · read 2026-09-05
Buys 2nm wafer foundry production of 6th Gen EPYC "Venice" server CPUs
AMD (NASDAQ: AMD) today announced that its next-generation AMD EPYC™ processor, codenamed “Venice,” is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys 3nm fabrication of the Maia 200 AI accelerator
Fabricated on TSMC’s cutting-edge 3-nanometer process, each Maia 200 chip contains over 140 billion transistors and is tailored for large-scale AI workloads while also delivering efficient performance per dollar.
Maia 200: The AI accelerator built for inference · Microsoft (The Official Microsoft Blog) · read 2026-09-11
Buys All wafers used in Cerebras products
We are currently dependent on TSMC to produce all of the wafers that we use in our products.
Cerebras prospectus (Form 424B4, May 2026) · Cerebras Systems Inc. · read 2026-09-11
Buys Assembly and test services
We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.
avgo-20251102 (Form 10-K fiscal 2025) · Broadcom Inc. · read 2026-09-11
Buys Fabrication of advanced silicon at Fab 21 in Arizona
The fund’s expansion includes a multibillion-dollar commitment from Apple to produce advanced silicon in TSMC’s Fab 21 facility in Arizona.
Apple will spend more than $500 billion in the U.S. over the next four years · Apple (Apple Newsroom) · read 2026-09-06
Buys Fabrication of all Astera Labs ICs
We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.
alab-20251231 (Form 10-K) · Astera Labs, Inc. · read 2026-09-11
Buys Foundry fabrication of compute die/tiles for Intel products
Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.
intc-20251227 · Intel Corporation (Form 10-K) · read 2026-09-05
Buys Foundry manufacturing of digital, analog/mixed-signal, RF and PM integrated circuits
The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.
qcom-20250928 (Form 10-K fiscal 2025) · QUALCOMM Incorporated · read 2026-09-11
Buys Foundry manufacturing of Qualcomm integrated circuits
The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.
qcom-20250928 (Form 10-K) · QUALCOMM Incorporated · read 2026-09-11
Buys Foundry manufacturing of the Cerebras wafer-scale processor
We depend on one third-party foundry, Taiwan Semiconductor Manufacturing Company Limited (“ TSMC”), to manufacture our proprietary processor using its fabrication equipment and techniques.
Cerebras Systems Inc. Form S-1/A (Amendment No. 2) · Cerebras Systems Inc. · read 2026-09-11
Buys Foundry wafer sales to GUC
In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.
tsm-20251231 (Form 20-F 2025) · Taiwan Semiconductor Manufacturing Company Limited · read 2026-09-11
Buys Front-end wafer manufacturing
The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”).
avgo-20251102 (Form 10-K fiscal 2025) · Broadcom Inc. · read 2026-09-11
Buys Semiconductor wafer production (sole foundry)
In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.
crdo-20260502 (Form 10-K) · Credo Technology Group Holding Ltd · read 2026-09-11
Buys Semiconductor wafer production as sole foundry
In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.
crdo-20260502 (Form 10-K fiscal 2026) · Credo Technology Group Holding Ltd · read 2026-09-11
Buys SoIC-X and CoWoS-L advanced packaging for AI and data center products
AMD and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC®-X and CoWoS®-L, used across AMD’s broader AI and data center portfolio.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys Wafer fabrication for Broadcom
During the three fiscal quarters ended August 2, 2026, approximately 95% of the wafers manufactured by our CMs were produced by Taiwan Semiconductor Manufacturing Company Limited (“TSMC”).
avgo-20260802 (Form 10-Q) · Broadcom Inc. · read 2026-09-11
Buys Wafer fabrication of Blackwell GPUs
NVIDIA founder and CEO Jensen Huang today visited TSMC's semiconductor manufacturing facility in Phoenix to celebrate the first NVIDIA Blackwell wafer produced on U.S. soil, representing that Blackwell has reached volume production.
The Engines of American-Made Intelligence: NVIDIA and TSMC Celebrate First NVIDIA Blackwell Wafer Produced in the US | NVIDIA Blog · NVIDIA · read 2026-09-05
Buys Foundry manufacturing for versions of Tesla's AI5 chip
Neither company states this. Reported by Tom's Hardware.
Slightly different versions of the Tesla AI5 chip will be made at TSMC and Samsung simply because they translate designs to physical form differently, but the goal is that our AI software works identically.
Musk confirms Tesla AI5 and AI6 will be made at both Samsung and TSMC, reinforcing dual-foundry strategy · Tom's Hardware · read 2026-09-06
Buys Foundry manufacturing in Arizona for Tesla's forthcoming AI5 chip
Neither company states this. Reported by CNBC.
Tesla's forthcoming AI chip called the AI5 will be manufactured by Samsung in Texas, as well as by TSMC in Arizona.
Tesla 'not about to replace Nvidia' as EV maker develops chips for cars, robots, Musk says · CNBC · read 2026-09-06
Buys N3-class foundry fabrication of Google's TPU v8 training and inference chips
Neither company states this. Reported by Tom's Hardware.
Both chips are fabricated on TSMC's N3 process family with HBM3E memory and will be available to Google Cloud customers later this year.
Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators | Tom's Hardware · Tom's Hardware · read 2026-09-05
Every company TSMC deals with, and its own other sites, are on the TSMC page.
Every change is appended, so an earlier value stays readable beside the one that replaced it.
Hsinchu, Taiwan, R.O.C., May 15, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.
5088 W. Innovation Circle, Phoenix, AZ 85083, U.S.A.
TSMC Arizona’s first fab is on track to begin production leveraging 4nm technology in first half of 2025. The second fab will produce the world’s most advanced 2nm process technology with next-generation nanosheet transistors in addition to the previously announced 3nm technology, with production beginning in 2028. The third fab will produce chips using 2nm or more advanced processes, with production beginning by the end of the decade.
Building on the company’s ongoing $65 billion investment in its advanced semiconductor manufacturing operations in Phoenix, Arizona, TSMC’s total investment in the U.S. is expected to reach US$165 billion.
TSMC's Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona.
TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion.
The expansion includes plans for three new fabrication plants, two advanced packaging facilities and a major R&D team center, solidifying this project as the largest single foreign direct investment in U.S. history.
TSMC Arizona owns a parcel of land of approximately 4,775,885 square meters in the State of Arizona where Fab 21 and related offices are located.
In November 2020, we established TSMC Arizona (of which the manufacturing entity is Fab 21), a wholly-owned subsidiary that is expected to be primarily engaged in the manufacture and sale of integrated circuits.
TSMC Arizona plans to build and operate multiple advanced semiconductor manufacturing facilities in Phoenix, Arizona.
Our first facility successfully entered high volume production at the end of 2024.
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