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Turns a design into silicon.
tsmc.com3 sourced relationships.
Supplies 300mm CVD, PVD, etch, CMP and ion implant systems
The volume order from TSMC includes Applied Materials' advanced 300mm systems for chemical vapor deposition (CVD), physical vapor deposition (PVD), etch, CMP (chemical mechanical planarization), and ion implant applications as well as for process diagnostics and control.
Just a moment... · TSMC · read 2026-09-05
Supplies EUV lithography systems (TWINSCAN NXE:3100)
ASML Holding NV (ASML) today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system.
Just a moment... · TSMC · read 2026-09-05
Supplies H200 GPUs and CUDA-accelerated computation for fab operations
By harnessing CUDA-powered computation on NVIDIA H200 GPUs, TSMC has enhanced its capability to manage complex constraints, thereby streamlining production paths and maximizing fab productivity.
NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing | NVIDIA Newsroom · NVIDIA · read 2026-09-05
8 sourced relationships.
Buys 12/16nm FinFET and 22/28nm process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC · read 2026-09-05
Buys 22/28nm and 12/16nm FinFET process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC, Sony Semiconductor Solutions, and DENSO · read 2026-09-05
Buys 28/22nm planar CMOS and 16/12nm FinFET process technology
When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology.
Just a moment... · TSMC · read 2026-09-05
Buys 2nm wafer foundry production of 6th Gen EPYC "Venice" server CPUs
AMD (NASDAQ: AMD) today announced that its next-generation AMD EPYC™ processor, codenamed “Venice,” is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys Foundry fabrication of compute die/tiles for Intel products
Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.
intc-20251227 · Intel Corporation (Form 10-K) · read 2026-09-05
Buys SoIC-X and CoWoS-L advanced packaging for AI and data center products
AMD and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC®-X and CoWoS®-L, used across AMD’s broader AI and data center portfolio.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys Wafer fabrication of Blackwell GPUs
NVIDIA founder and CEO Jensen Huang today visited TSMC's semiconductor manufacturing facility in Phoenix to celebrate the first NVIDIA Blackwell wafer produced on U.S. soil, representing that Blackwell has reached volume production.
The Engines of American-Made Intelligence: NVIDIA and TSMC Celebrate First NVIDIA Blackwell Wafer Produced in the US | NVIDIA Blog · NVIDIA · read 2026-09-05
Buys N3-class foundry fabrication of Google's TPU v8 training and inference chips
Neither company states this. Reported by Tom's Hardware.
Both chips are fabricated on TSMC's N3 process family with HBM3E memory and will be available to Google Cloud customers later this year.
Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators | Tom's Hardware · Tom's Hardware · read 2026-09-05
7 on the map, in 2 places.
Advanced packaging and testing: SoIC, InFO and CoWoS
Advanced packaging
12-inch GIGAFAB wafer fabrication
5nm and 3nm GIGAFAB wafer fabrication
12-inch GIGAFAB wafer fabrication
4nm wafer fabrication in the first fab; 3nm and 2nm fabs to follow