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ESMC / Dresden / Saxony / DE
28/22 nm planar CMOS and 16/12 nm FinFET wafer fabrication
ESMC is building Fab 24, the semiconductor fab in Dresden that TSMC will operate as a foundry open to customers beyond its partners Bosch, Infineon and NXP. It will initially focus on 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology and develop variants for automotive applications, embedded flash, RRAM, MRAM, radio frequency and other non-volatile memories. ESMC states that it will be the first and so far only pure play foundry to establish sustainable mass production with FinFET capability on EU soil. The fab is designed for a capacity of 480,000 wafers per year and is expected to create nearly 2,000 direct high-tech professional jobs when full capacity is reached, and ESMC expects tool-in in 2027.
ESMC will initially focus on 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
TSMC will operate the fab according to the foundry business model, ensuring openness to customers beyond Bosch, Infineon and NXP and focusing on collaboration rather than competition.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
It will develop technology variants with a special focus on innovative differentiating technologies like automotive applications, embedded flash, RRAM, MRAM, Radio Frequency (RF) and other non-volatile memories.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
ESMC will be the first and so far, only pure play foundry to establish a sustainable mass production with FinFET capability on EU soil.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
The fab will be designed for a capacity of 480,000 wafers per year and create nearly 2,000 direct high-tech professional jobs when full capacity is reached.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
The construction progress is proceeding smoothly and we expect to have tool-in in 2027.
Who We Are | European Semiconductor Manufacturing Company · European Semiconductor Manufacturing Company (ESMC) GmbH · read 2026-09-05
Published figures for 2025, from the source named under them.
Who ESMC buys from and sells to, each relationship carrying the source that states it.
Supplies 28/22nm planar CMOS and 16/12nm FinFET process technology
When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology.
Just a moment... · TSMC · read 2026-09-05
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Every company ESMC deals with, and its own other sites, are on the ESMC page.
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European Semiconductor Manufacturing Company (ESMC) is a joint venture between TSMC, Bosch, Infineon and NXP to establish an advanced semiconductor fab in Dresden, Saxony, Germany.
We broke ground for ESMC in August 2024 with a focus on automotive and industrial applications.
The construction of the ESMC facility in Dresden is well underway, reaching key milestones in both structural developments and sustainability.
ESMC will initially focus on 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.
TSMC will operate the fab according to the foundry business model, ensuring openness to customers beyond Bosch, Infineon and NXP and focusing on collaboration rather than competition.
It will develop technology variants with a special focus on innovative differentiating technologies like automotive applications, embedded flash, RRAM, MRAM, Radio Frequency (RF) and other non-volatile memories.
ESMC will be the first and so far, only pure play foundry to establish a sustainable mass production with FinFET capability on EU soil.
The fab will be designed for a capacity of 480,000 wafers per year and create nearly 2,000 direct high-tech professional jobs when full capacity is reached.
The construction progress is proceeding smoothly and we expect to have tool-in in 2027.
ESMC owns a parcel of land of approximately 513,557 square meters in the City of Dresden in Germany, where Fab 24 and related facilities will be located.
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