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TSMC / Taibao City / Chiayi County / TW
Advanced packaging
Advanced Backend Fab 7 is TSMC's advanced packaging and testing site in the Chiayi Science Park, and its first site in Chiayi after Taoyuan, Hsinchu, Miaoli, Taichung, Tainan and Kaohsiung; TSMC names Chiayi, with Tainan, as where it expanded advanced packaging capacity in 2025. TSMC calls the fab a key part of its continued investment in advanced packaging capacity in Taiwan and expects it to become its largest advanced packaging and testing site. Equipment move-in at the phase 1 building began in December 2025 and the phase 2 building is being built to plan. Taiwan's National Science and Technology Council says TSMC placed two advanced packaging fabs in phase one of the park, is building three more in phase two, and began volume production there in June 2026.
In 2025, TSMC expanded its advanced packaging capacity in Chiayi and Tainan, and actively commencing the construction of its 1.4-nanometer fab in Taichung.
GIGAFAB® Facilities - Taiwan Semiconductor Manufacturing Company Limited · TSMC · read 2026-09-05
台積電表示，嘉義先進封測七廠是台積電在台灣持續投資先進封裝產能的關鍵一環，可望成為台積電最大的先進封測廠區。
蔗田轉為矽田 嘉義七廠將成台積電最大先進封測廠區 | 產經 | 中央社 CNA · 中央社 CNA (Central News Agency, Taiwan) · read 2026-09-05
第一期廠房已於2025年12月開始進機，第二期廠房依計畫建置中，建廠進展順利，將從2年前的蔗田，變成未來的「矽田」。
蔗田轉為矽田 嘉義七廠將成台積電最大先進封測廠區 | 產經 | 中央社 CNA · 中央社 CNA (Central News Agency, Taiwan) · read 2026-09-05
（中央社記者蔡智明嘉義縣12日電）國科會主委吳誠文今天說，台積電在嘉義科學園區一期設置2座先進封裝廠後，要在今天動土的嘉科二期再建3座封裝廠，打造全球先進封裝重鎮。
嘉科二期台積電再設3座廠 打造全球先進封裝重鎮 | 產經 | 中央社 CNA · 中央社 CNA (Central News Agency, Taiwan) · read 2026-09-05
Published figures for 2025, from the source named under them.
Who TSMC buys from and sells to, each relationship carrying the source that states it.
Supplies 300mm CVD, PVD, etch, CMP and ion implant systems
The volume order from TSMC includes Applied Materials' advanced 300mm systems for chemical vapor deposition (CVD), physical vapor deposition (PVD), etch, CMP (chemical mechanical planarization), and ion implant applications as well as for process diagnostics and control.
Just a moment... · TSMC · read 2026-09-05
Supplies EUV lithography systems (TWINSCAN NXE:3100)
ASML Holding NV (ASML) today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system.
Just a moment... · TSMC · read 2026-09-05
Supplies H200 GPUs and CUDA-accelerated computation for fab operations
By harnessing CUDA-powered computation on NVIDIA H200 GPUs, TSMC has enhanced its capability to manage complex constraints, thereby streamlining production paths and maximizing fab productivity.
NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing | NVIDIA Newsroom · NVIDIA · read 2026-09-05
Supplies Process control and inspection equipment
For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited
klac-20260630 (Form 10-K, fiscal 2026) · KLA Corporation · read 2026-09-11
Supplies Semiconductor materials and contamination-control products
2025 2024 2023 Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16% 16% 11%
entg-20251231 (Form 10-K, 2025) · Entegris, Inc. · read 2026-09-11
Supplies Semiconductor production equipment
Major customer information (Millions of yen) Net sales Name of customer Samsung Electronics Co., Ltd. 368,079 Taiwan Semiconductor Manufacturing Company Ltd. 315,813 (Note) The amount includes sales to the customer and its subsidiaries.
Consolidated Financial Statements FY2026 · Tokyo Electron Limited · read 2026-09-11
Supplies Semiconductor test systems
The customer groups that accounted for 10% or more of the net sales were the NVIDIA Group and Taiwan Semiconductor Manufacturing Co., Ltd. for the fiscal year ended March 31, 2026.
Securities and Business Report, 84th fiscal year (ended March 31, 2026) · Advantest Corporation · read 2026-09-11
Supplies Wafer fabrication equipment
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K fiscal 2026) · Lam Research Corporation · read 2026-09-11
Supplies Wafer fabrication equipment and services
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K, fiscal 2026) · Lam Research Corporation · read 2026-09-11
Buys 12/16nm FinFET and 22/28nm process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC · read 2026-09-05
Buys 22/28nm and 12/16nm FinFET process technology
To support market demand, TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers.
Just a moment... · TSMC, Sony Semiconductor Solutions, and DENSO · read 2026-09-05
Buys 28/22nm planar CMOS and 16/12nm FinFET process technology
When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology.
Just a moment... · TSMC · read 2026-09-05
Buys 2nm wafer foundry production of 6th Gen EPYC "Venice" server CPUs
AMD (NASDAQ: AMD) today announced that its next-generation AMD EPYC™ processor, codenamed “Venice,” is ramping production in Taiwan on TSMC’s advanced 2nm process technology, with future plans to ramp production at TSMC’s Arizona fabrication facility.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys 3nm fabrication of the Maia 200 AI accelerator
Fabricated on TSMC’s cutting-edge 3-nanometer process, each Maia 200 chip contains over 140 billion transistors and is tailored for large-scale AI workloads while also delivering efficient performance per dollar.
Maia 200: The AI accelerator built for inference · Microsoft (The Official Microsoft Blog) · read 2026-09-11
Buys All wafers used in Cerebras products
We are currently dependent on TSMC to produce all of the wafers that we use in our products.
Cerebras prospectus (Form 424B4, May 2026) · Cerebras Systems Inc. · read 2026-09-11
Buys Assembly and test services
We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.
avgo-20251102 (Form 10-K fiscal 2025) · Broadcom Inc. · read 2026-09-11
Buys Fabrication of advanced silicon at Fab 21 in Arizona
The fund’s expansion includes a multibillion-dollar commitment from Apple to produce advanced silicon in TSMC’s Fab 21 facility in Arizona.
Apple will spend more than $500 billion in the U.S. over the next four years · Apple (Apple Newsroom) · read 2026-09-06
Buys Fabrication of all Astera Labs ICs
We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.
alab-20251231 (Form 10-K) · Astera Labs, Inc. · read 2026-09-11
Buys Foundry fabrication of compute die/tiles for Intel products
Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.
intc-20251227 · Intel Corporation (Form 10-K) · read 2026-09-05
Buys Foundry manufacturing of digital, analog/mixed-signal, RF and PM integrated circuits
The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.
qcom-20250928 (Form 10-K fiscal 2025) · QUALCOMM Incorporated · read 2026-09-11
Buys Foundry manufacturing of Qualcomm integrated circuits
The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.
qcom-20250928 (Form 10-K) · QUALCOMM Incorporated · read 2026-09-11
Buys Foundry manufacturing of the Cerebras wafer-scale processor
We depend on one third-party foundry, Taiwan Semiconductor Manufacturing Company Limited (“ TSMC”), to manufacture our proprietary processor using its fabrication equipment and techniques.
Cerebras Systems Inc. Form S-1/A (Amendment No. 2) · Cerebras Systems Inc. · read 2026-09-11
Buys Foundry wafer sales to GUC
In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.
tsm-20251231 (Form 20-F 2025) · Taiwan Semiconductor Manufacturing Company Limited · read 2026-09-11
Buys Front-end wafer manufacturing
The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”).
avgo-20251102 (Form 10-K fiscal 2025) · Broadcom Inc. · read 2026-09-11
Buys Semiconductor wafer production (sole foundry)
In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.
crdo-20260502 (Form 10-K) · Credo Technology Group Holding Ltd · read 2026-09-11
Buys Semiconductor wafer production as sole foundry
In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.
crdo-20260502 (Form 10-K fiscal 2026) · Credo Technology Group Holding Ltd · read 2026-09-11
Buys SoIC-X and CoWoS-L advanced packaging for AI and data center products
AMD and TSMC’s partnership spans the technologies needed to scale modern data center computing, from TSMC 2nm process technology for next-generation CPUs to advanced packaging technologies, including TSMC’s SoIC®-X and CoWoS®-L, used across AMD’s broader AI and data center portfolio.
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology :: Advanced Micro Devices, Inc. (AMD) · AMD Investor Relations · read 2026-09-05
Buys Wafer fabrication for Broadcom
During the three fiscal quarters ended August 2, 2026, approximately 95% of the wafers manufactured by our CMs were produced by Taiwan Semiconductor Manufacturing Company Limited (“TSMC”).
avgo-20260802 (Form 10-Q) · Broadcom Inc. · read 2026-09-11
Buys Wafer fabrication of Blackwell GPUs
NVIDIA founder and CEO Jensen Huang today visited TSMC's semiconductor manufacturing facility in Phoenix to celebrate the first NVIDIA Blackwell wafer produced on U.S. soil, representing that Blackwell has reached volume production.
The Engines of American-Made Intelligence: NVIDIA and TSMC Celebrate First NVIDIA Blackwell Wafer Produced in the US | NVIDIA Blog · NVIDIA · read 2026-09-05
Buys Foundry manufacturing for versions of Tesla's AI5 chip
Neither company states this. Reported by Tom's Hardware.
Slightly different versions of the Tesla AI5 chip will be made at TSMC and Samsung simply because they translate designs to physical form differently, but the goal is that our AI software works identically.
Musk confirms Tesla AI5 and AI6 will be made at both Samsung and TSMC, reinforcing dual-foundry strategy · Tom's Hardware · read 2026-09-06
Buys Foundry manufacturing in Arizona for Tesla's forthcoming AI5 chip
Neither company states this. Reported by CNBC.
Tesla's forthcoming AI chip called the AI5 will be manufactured by Samsung in Texas, as well as by TSMC in Arizona.
Tesla 'not about to replace Nvidia' as EV maker develops chips for cars, robots, Musk says · CNBC · read 2026-09-06
Buys N3-class foundry fabrication of Google's TPU v8 training and inference chips
Neither company states this. Reported by Tom's Hardware.
Both chips are fabricated on TSMC's N3 process family with HBM3E memory and will be available to Google Cloud customers later this year.
Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators | Tom's Hardware · Tom's Hardware · read 2026-09-05
Every company TSMC deals with, and its own other sites, are on the TSMC page.
Every change is appended, so an earlier value stays readable beside the one that replaced it.
68, Jiake 5st Rd., Taibao City, Chiayi County 612-013, Taiwan, R.O.C.
In 2024, TSMC established 2nm advanced manufacturing facilities in Hsinchu and Kaohsiung, and expanded advanced packaging capabilities in Chiayi and Tainan.
In 2025, TSMC expanded its advanced packaging capacity in Chiayi and Tainan, and actively commencing the construction of its 1.4-nanometer fab in Taichung.
嘉義先進封測七廠為台積電繼桃園、新竹、苗栗、台中，台南與高雄廠區，首次落腳嘉義的據點。
吳誠文指出，嘉科一期台積電先進封裝廠已於今年6月開始量產，而嘉科二期先進封裝廠與基地工程同步進行建廠中，此外園區污水廠、配水池、複合樓群等公共工程也持續同步建置中。
台積電表示，嘉義先進封測七廠是台積電在台灣持續投資先進封裝產能的關鍵一環，可望成為台積電最大的先進封測廠區。
第一期廠房已於2025年12月開始進機，第二期廠房依計畫建置中，建廠進展順利，將從2年前的蔗田，變成未來的「矽田」。
（中央社記者蔡智明嘉義縣12日電）國科會主委吳誠文今天說，台積電在嘉義科學園區一期設置2座先進封裝廠後，要在今天動土的嘉科二期再建3座封裝廠，打造全球先進封裝重鎮。
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