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SK hynix / Cheongju / Chungcheongbuk-do / KR
NAND and HBM memory manufacturing hub
SK hynix's Cheongju Campus houses the M11, M12 and M15 fabs, and the company describes M15 as the fab that strengthens its NAND flash business. Cheongju M15X is being developed as a production hub optimized for next-generation DRAM such as HBM. SK hynix selected Cheongju as the base for its next NAND fab, M17, saying the site offers the fastest fab construction timeline; M17 is to cover roughly 680,000 square metres and open its first cleanroom in December 2028.
As demand for high-performance memory continues to surge, driven primarily by AI data centers, SK hynix plans to further develop Cheongju into a comprehensive manufacturing hub encompassing NAND, HBM, and advanced packaging.
Explainer: SK hynix’s Mid-to-Long-Term Investment Strategy – SK hynix Newsroom · SK hynix · read 2026-09-05
The Cheongju Campus already houses the M11, M12, and M15 fabs, enabling efficient production linked to existing operations on sites equipped with substantial pre-established power and water infrastructure.
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand – SK hynix Newsroom · SK hynix · read 2026-09-05
SK hynix selected Cheongju as its new NAND fab base because it offers the fastest fab construction timeline.
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand – SK hynix Newsroom · SK hynix · read 2026-09-05
Cheongju M17 will be built across a total area of 206,000 pyeong(approximately 680,000m²), breaking ground in February next year with plans to open its first cleanroom in December 2028.
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand – SK hynix Newsroom · SK hynix · read 2026-09-05
Published figures for 2025, from the source named under them.
Who SK hynix buys from and sells to, each relationship carrying the source that states it.
Supplies High NA EUV lithography system for next-generation DRAM
At an event to commemorate the assembly of the system, SK hynix’s Head of R&D Cha Seon Yong, Head of Manufacturing Technology Lee Byoungki and ASML’s Head of Customer Team SK hynix-Japan Kim Byeong-Chan celebrated the introduction of the equipment to produce next-generation DRAM.
SK hynix Introduces Industry’s First Commercial High NA EUV · SK hynix Newsroom · read 2026-09-11
Supplies High-NA EUV lithography system (EXE:5200B) at the M16 fab
SK hynix has installed the first High-NA EUV system for mass production at its M16 fab, using ASML’s EXE:5200B.
SK hynix Introduces Industry’s First Commercial High NA EUV · SK hynix Inc. · read 2026-09-11
Supplies Wafer fabrication equipment
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K fiscal 2026) · Lam Research Corporation · read 2026-09-11
Supplies Wafer fabrication equipment and services
Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.
lrcx-20260628 (Form 10-K, fiscal 2026) · Lam Research Corporation · read 2026-09-11
Supplies HBM production equipment
Neither company states this. Reported by The Korea Herald.
SK hynix Inc. has ordered new high-bandwidth memory (HBM) production equipment from Hanmi Semiconductor in a deal worth 44.2 billion won (US$28.7 million), a regulatory filing showed Monday, in a possible bid to expand production of HBM4 products for U.S. chip giant Nvidia Corp.
SK hynix orders new equipment worth 44.2 bln won for next-gen HBM4 · The Korea Herald · read 2026-09-11
Supplies TC Bonder 4.5 Griffin thermal compression bonding equipment
Neither company states this. Reported by The Elec.
Hanmi Semiconductor said on June 8 that it signed a 44.2 billion won contract with SK hynix to supply its "TC Bonder 4.5 Griffin" equipment.
Hanmi Semiconductor Wins First HBM4 TC Bonder Order From SK hynix · The Elec · read 2026-09-11
Buys Advanced memory technologies for NVIDIA AI computing platforms
SK hynix has been an extraordinary partner to NVIDIA, playing a central role in delivering advanced memory technologies for NVIDIA AI computing platforms.
NVIDIA and SK hynix Announce Multiyear Technology Partnership to Advance Memory for AI Factories | NVIDIA Newsroom · NVIDIA · read 2026-09-05
Buys HBM memory supplied for Google TPU programs
Neither company states this. Reported by TrendForce News, citing Chosun Biz and industry estimates.
Industry estimates suggest that Samsung and SK hynix supplied Google with comparable HBM volumes this year, and some analysts believe Samsung may even hold a small lead.
[News] Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply · TrendForce · read 2026-09-05
Every company SK hynix deals with, and its own other sites, are on the SK hynix page.
Every change is appended, so an earlier value stays readable beside the one that replaced it.
At the far edge of the Cheongju Technopolis Industrial Complex in Oebuk-dong, Heungdeok-gu, Cheongju-si, Chungcheongbuk-do, the imposing silhouette of SK hynix’s nearby Cheongju Campus M15X stretches long across the horizon, while a vast expanse of land unfolds far beyond the line of sight.
P&T7 is also the fifth production facility SK hynix is building in Cheongju, following M11, M12, M15, and M15X.
Cheongju M15X is being developed as a production hub optimized for next-generation DRAM, such as HBM, while Cheongju P&T7 is being established as an advanced packaging fab dedicated to AI memory products, including HBM.
In Cheongju, the company runs a fab called M15 which strengthens the company’s NAND flash business.
SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally.
As demand for high-performance memory continues to surge, driven primarily by AI data centers, SK hynix plans to further develop Cheongju into a comprehensive manufacturing hub encompassing NAND, HBM, and advanced packaging.
The Cheongju Campus already houses the M11, M12, and M15 fabs, enabling efficient production linked to existing operations on sites equipped with substantial pre-established power and water infrastructure.
SK hynix selected Cheongju as its new NAND fab base because it offers the fastest fab construction timeline.
Cheongju M17 will be built across a total area of 206,000 pyeong(approximately 680,000m²), breaking ground in February next year with plans to open its first cleanroom in December 2028.
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