ASE Technology

PackagingTW

Joins the die to its memory.

aseglobal.com

Buys from

4 sourced relationships.

Lam ResearchEquipment
Supplies Packaging equipment
Evidence from ASE Technology Holding Co., Ltd.
1. We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.
  ASE Technology Form 20-F 2025 · ASE Technology Holding Co., Ltd. · read 2026-09-11
Tokyo ElectronEquipment
Supplies Packaging equipment
Evidence from ASE Technology Holding Co., Ltd.
1. We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.
  Form 20-F, 2025 annual report · ASE Technology Holding Co., Ltd. · read 2026-09-11
Supplies Semiconductor testers
Evidence from ASE Technology Holding Co., Ltd.
1. We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.
  ASE Technology Form 20-F 2025 · ASE Technology Holding Co., Ltd. · read 2026-09-11
TeradyneEquipment
Supplies Semiconductor testers
Evidence from ASE Technology Holding Co., Ltd.
1. We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.
  ASE Technology Form 20-F 2025 · ASE Technology Holding Co., Ltd. · read 2026-09-11
AdvantestEquipment
Supplies Semiconductor testers
Evidence from ASE Technology Holding Co., Ltd.
1. We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.
  ASE Technology Form 20-F 2025 · ASE Technology Holding Co., Ltd. · read 2026-09-11

Sells to

5 sourced relationships.

Credo TechnologyNetworking
Buys Assembly and test of IC products
Evidence from Credo Technology Group Holding Ltd
1. We also use third-party contract manufacturers for a significant majority of our assembly and test operations, including Amkor, ASE, KYEC and Sigurd for our IC products, and BizLink for our AEC products.
  crdo-20260502 (Form 10-K fiscal 2026) · Credo Technology Group Holding Ltd · read 2026-09-11
BroadcomChip designer
Buys Assembly and test operations
Evidence from Broadcom Inc.
1. We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.
  avgo-20251102 (Form 10-K fiscal 2025) · Broadcom Inc. · read 2026-09-11
Buys Assembly and test services
Evidence from Broadcom Inc.
1. We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.
  avgo-20251102 (Form 10-K) · Broadcom Inc. · read 2026-09-11
AMDChip designer
Buys Assembly, test, mark and packaging services through ASE subsidiary SPIL
Evidence from Advanced Micro Devices, Inc.
1. The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.
  amd-20251227 (Form 10-K) · Advanced Micro Devices, Inc. · read 2026-09-11
Buys Assembly, test, mark and packaging services through SPIL
Evidence from Advanced Micro Devices, Inc.
1. The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.
  amd-20251227 (Form 10-K 2025) · Advanced Micro Devices, Inc. · read 2026-09-11
Astera LabsChip designer
Buys IC assembly, packaging and test
Evidence from Astera Labs, Inc.
1. We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.
  alab-20251231 (Form 10-K) · Astera Labs, Inc. · read 2026-09-11
QualcommChip designer
Buys Semiconductor assembly and test
Evidence from QUALCOMM Incorporated
1. Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.
  qcom-20250928 (Form 10-K fiscal 2025) · QUALCOMM Incorporated · read 2026-09-11
Buys Semiconductor assembly and test services
Evidence from QUALCOMM Incorporated
1. Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.
  qcom-20250928 (Form 10-K) · QUALCOMM Incorporated · read 2026-09-11

Sites

8 recorded, 3 drawn on the map, in 2 places.

Taiwan2

ASE Chung-LiFabs · Zhongli District
ASE Technology Holding HeadquartersHeadquarters · Nanzih District

In no GPUQuant place6

ASE KaohsiungFabs · Nanzih District
ASE Korea (Paju)Fabs · Paju
ASE Malaysia (Penang)Fabs · Bayan Lepas
SPIL Headquarters and Da Fong FacilityFabs · Tanzi District
SPIL SuzhouFabs · Suzhou
SPIL Tan Ke PlantFabs · Tanzi District